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Area Array Packaging Handbook Manufacturing and Assembly cover
  • ISBN: 9780071374934
  • ISBN10: 0071374930

Area Array Packaging Handbook Manufacturing and Assembly

by Ken Gilleo

  • List Price: $131.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 11/01/2001
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Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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