Error title
Some error text about your books and stuff.
Close
Electronic Packaging Design, Materials, Process, and Reliability cover
  • ISBN: 9780070371354
  • ISBN10: 0070371350

Electronic Packaging Design, Materials, Process, and Reliability

by John H. Lau

  • List Price: $69.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 03/01/1998
used Add to Cart $28.06
You save: 59%
Marketplace Item
new Add to Cart $68.73
Marketplace Item
Description
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all major packaging and interconnection technologies and details all the newest technologies, including BGA, Flip Chip, and CSP.
Expand description
Seller Condition Comments Price  
HPB-Dallas

Location: Dallas, TX
Good
Shipping Icon
Item may show signs of shelf wear. Pages may include limited notes and
[...]
$28.06
Goodwill Books

Location: Hillsboro, OR
Good
Sound copy that may show minimal signs of wear or previous ownership.
$31.43
Firecreek Books

Location: Germantown, TN
Good
$54.58
Book Panther

Location: Wellington, FL
New
0070371350 New Condition.
$68.73
Ergodebooks

Location: Richmond, TX
Ask seller a question
Good
Buy with confidence. Excellent Customer Service & Return policy.
$69.08
Ergodebooks

Location: Richmond, TX
Ask seller a question
New
Buy with confidence. Excellent Customer Service & Return policy.
$157.52