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  • ISBN: 9780070366091
  • ISBN10: 0070366098

Flip Chip Technologies

by John H. Lau

  • List Price: $89.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 06/01/1996
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Description: Introduction.Fluxes Flip Solder Jointing.Solder Bump FCT.Solder Bump FCT with Very Large Dies.Micro Solder Bump FCT on Silicon Technologies.Conductive Adhesive Polymer Materials.Anistropic Conductive Flip Chip-on-Glass Technology.FC Assembly with Compliant Bumps.FC Assembly on Rigid and Flexible Polymer Substrates Using TAB.A Compliant TAB Micro Ball Grid Array Technology.Wirebonding FCT for Multichip Modules.FC Mounting Using Stud Bumps and Adhesives for Encapsulation.Wire Interconnect Technology.Known Good Dies Assurance Technologies.Known Good Die Testing of FCT.
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Better World Books West
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Ships from Reno, NV. Former Library book. Shows some signs of wear, and may
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$28.63
HPB-Dallas
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Item may show signs of shelf wear. Pages may include limited notes and
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Bookmans
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FastBooks100
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Found Books
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