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  • ISBN: 9780071363273
  • ISBN10: 0071363270

Microvias Low Cost, High Density Interconnects

by John H. Lau

  • List Price: $99.95
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 04/01/2001
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Description: -- The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards -- and driving the mobile electronic revolution
-- A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation
-- Features a detailed survey of the work of leading companies -- and their products from around the globe
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New Book Paperback International edition, Ships with Emailed Tracking from USA. We Ship to PO BOX Address also.
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This is a used book in good condition and may show some signs of use or wear.
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Brand New! The covers look great. The binding is tight. The interior pages are clean and unmarked. Free USPS electronic delivery tracking. pp. 565.
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