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Modern Solder Technology for Competitive Electronics Manufacturing cover
  • ISBN: 9780070317499
  • ISBN10: 0070317496

Modern Solder Technology for Competitive Electronics Manufacturing

by Jennie S. Hwang

  • List Price: $89.95
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 04/01/1996
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Description
Introduction. Advanced Surface Mount Technology and Die Attach Techniques. Solder Material. Soldering Chemistry. Solderability. Microstructure of Solders. Aqueous-Cleaning Manufacture. No-Clean Manufacture. Protective and Reactive Atmosphere Soldering. Surface Mount Fine Pitch Technology. Surface Mount-BGA/PAC Technology. Soldering Methodology and Equipment. Soldering and Soldering Related Issues. Strengthened Solders. Lead-Free Solders. Solder Joint Failure Mode. Solder Joint Failure Assessment-Case Studies. Solder Joint Quality and Reliability. New and Emerging Specifications and Standards. Future Trends.
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