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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies cover
  • ISBN: 9780070366480
  • ISBN10: 0070366489

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

by LAU

  • List Price: $65.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill Professional
  • Publish date: 01/01/2006
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Description
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
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Reading copy. May have signs of wear and previous use (scuffs, writing, underlining). Dust jacket may be missing.
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0070366489.
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Hardback book in near fine condition.
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