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Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield cover
  • ISBN: 9780070326194
  • ISBN10: 0070326193

Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield

by George G. Harman

  • List Price: $79.00
  • Binding: Hardcover
  • Edition: 2
  • Publisher: McGraw-Hill
  • Publish date: 08/01/1997
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Description
One of the most widely used engineering books in packaging gets a full updating in this classic from the International Microelectronics and Packaging Society (IMAPS).

Special emphasis is given to higher density interconnection techniques developed since the first edition. New sections are included on fine pitch SMT and new bonding metallurgies, as well as wire sweep and the wire bonding mechanism. Users gain guidance on how to make reliable bonds at a very high yield ... bond wires to multichip modules ... solve common bonding problems ... make trade-offs between new bonding technologies ... implement the latest techniques of wire bond testing ... and use cleaning techniques that improve bondability and reliability.

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