Description: An impressive, unparalleled reference to the critical manufacturing technology in the electronics and microelectronics industry with real-world applications--a must for all involved in research, production, quality control, and decision-making management. The electronics industry, in its exciting and changing time, ahs responded and continues to respond to the needs of competitive products in the global market place. Today's and future electronics products must deliver faster speeds, lighter weights, smaller sizes at lower cost, and increased durability. It is continuing challenge for manufacturers. This new comprehensive book helps you to meet that challenge and exceed its demands. In it, you will find complete coverage of all relevant technologies that are associated with the application of solder for electronic and microelectraonic packaging and assembly. For the first time, a practical treatment of this interdisciplinary field is given. The book also includes a proper level of underlying fundamentals that are important to the practical applications. The book reflects the author-s belief that value-added industrial applications stem from the synergistic result of a general understanding of a wide spectrum of techniques and practices and an indepth knowledge of a targeted application area. The material is intended to be neither too theoretical for readers with only practical applications in mind nor too descriptive for those who have extensive background in the subject. The ultimate purpose of the book is to provide the industry an integrated source of knowledge and information for implementing a manufacturing system which will produce ever-improved electrical, thermal, and mechanical performance of electronic circuits, covering products from computers and telecommunications to medical devices, weaponry, and household applicances and automobiles. Of the Twenty chapters, highlights include: Market driving forces and benchmark technologies; Surface mount soldering chemistry; Wetting and solderability; No-clean and water-clean manufacturing; Fine pitch technology; Soldering methodologies; Solder joint failure modes and reliability; future prospects and emerging technologies, including flip chip and chip-scale packaging and assembly; Materials characteristics and process troubleshooting; State-of-the-art IC packages; IC lead coating and PCB surface finish; BGA technology; Atmosphere soldering; Lead-free solders; A wealth of data and tables for quick reference; New and revised specifications and standards. Without question, this is the most comprehensive and insightful reference guide for the decade--the one everyone involved in this high-profile, critical manufacturing area should have and use. demands.

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