Electronic Packaging of High Speed Circuitry
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 02/01/1997
Description:
Technologies such as Pentium chips and HDTV are quickly making traditional circuit packaging methods obsolete. This book shows how to design and package the high frequency circuitry demanded by today's advanced electronic products.
Expand description
Two of the field's best-known innovators provide complete descriptions of both high speed and microwave circuits packaging. This guide also details important points about materials selection, and discusses crucial manufacturing considerations.
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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