Electronic Packaging Design, Materials, Process, and Reliability
- List Price: $69.00
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 03/01/1998
Description:
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all major packaging and interconnection technologies and details all the newest technologies, including BGA, Flip Chip, and CSP.
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