Description: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with very low dielectric constants. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high-speed IC packaging). Considerable efforts have been made to develop both new low and high dielectric constant materials for applications in electronics industries, as well as materials with good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, and corrosion resistance. This is a rapidly growing held of science -- both in novel materials and in their applications to future packing technologies, because the experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature, it is timely to consolidate the current knowledge on low and high dielectric constant materials into a single reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications brings together under a single cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all aspects of inorganic and organic materials from their synthetic chemistry, processing techniques, physics, and structure-property relationship to applications in IC devices. This book summarizes the current status of the held covering important scientific developments over the past decade with contributions from internationally recognized experts. This book has clear, precise, and wide appeal as an essential reference source for all those interested inlow and high dielectric constant material.

Please Wait