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Area Array Packaging Handbook Manufacturing and Assembly

by Ken Gilleo

ISBN: 9780071374934
ISBN10: 0071374930

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Area Array Packaging Handbook Manufacturing and Assembly

by Ken Gilleo

List Price: $131.00
Binding: Hardcover
Edition: 1
Publisher: McGraw-Hill
Publish date: 11/01/2001
ISBN: 9780071374934
ISBN10: 0071374930

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Description: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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Area Array Packaging Handbook Manufacturing and Assembly

by Ken Gilleo

Area Array Packaging Handbook Manufacturing and Assembly

by Ken Gilleo

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