Area Array Packaging Handbook Manufacturing and Assembly
- List Price: $131.00
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 11/01/2001
Description:
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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