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Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications

by John H. Lau

  • ISBN: 9780070383043
  • ISBN10: 0070383049

Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications

by John H. Lau

  • List Price: $89.50
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 02/01/1999
  • ISBN: 9780070383043
  • ISBN10: 0070383049
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Description: Part I: Flip Chip and Wire Bond for CSP. Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate. Part II: Customized Leadframe Based CSPs. Fujitsu's Small Outline No-Lead/C-Lead Package (SON/SOC). Fujitsu's Bump Chip Carrier (BCC). Fujitsu's MicroBGA and Quad Flat Nonleaded Package (QFN). Hitachi Cable's Lead-on-Chip Chip Scale Package (LOC-CSP). Hitachi Cable's Micro Stud Array Package (MSA). LG Semicon's Bottom-Leaded Plastic Package (BLP). TI Japan's Memory Chip Scale Package with LOC (MCSP). Part III: CSPs with Flexible Substrate. 3M's Enhanced Flex CSP. General Electric's Chip-on-Flex Chip Scale Package (COF-CSP). Hitachi's Chip Scale Package for Memory Devices. IZM's flexPAC. NEC's Fine-Pitch Ball Grid Array (FPBGA). Nitto Denko's Molded Chip Size Package (MCSP). Sharp's Chip Scale Package. Tessera's Micro-Ball Grid Array. TI Japan's Micro-Star BGA. TI Japan's Memory Chip Scale Package with Flexible Substrate (MCSP). Part IV: CSPs with Rigid Substrate. Amkor/Anam's ChipArray Package. EPS's Low-Cost Solder-Bumped Flip Chip NuCSP. IBM's Ceramic Mini-Ball Grid Array Package (Mini-BGA). IBM's Flip Chip-Plastic Ball Grid Array Package (FC/PBGA). Matsuhita's MN-PAC. Motorola's SLICC and JACS-Pak. National Semiconductor's Plastic Chip Carrier (PCC). NEC's Three-Dimensional Memory Module (3DM) and CSP. Sony's Transformed Grid Array Package (TGA). Toshiba's Ceramic/Plastic Fine-Pitch BGA Package (C/P-FBGA). Part V: Wafer-Level Redistribution CSPs. ChipScale's Micro SMT Package (MSMT). EPIC's Chip Scale Package. Flip Chip Technologies' UltraCSP. Fujitsu's Super CSP (SCSP). Mitsubishi's Chip Scale Package (CSP). National Semiconductor's SMD. Sandia National Laboratories' Mini Ball Grid Array Package (mBGA). ShellCase's Shell-PACK/Shell-BGA.
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8vo-over 7¾"-9¾" tall. The first comprehensive, in-depth guide to chip
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8vo-over 7¾"-9¾" tall. The first comprehensive, in-depth guide to chip
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