Description: The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus detailson more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip charts,rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Mitsubishi, TI, Amkor, LG Semicon, Tessera, Samsung, Shell Case, Matushita, Motorola, National Semiconductor, NEC, Sharp,Sony, Toshiba, and other major companies; learn about CPS products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical detials and an eye-opening overview of this fast-developing field. No matter how you use ChipScale Package, you'll see why it's the resource of choice for those who want to be at the top of the game.

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