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Electronic Packaging Design, Materials, Process, and Reliability

by John H. Lau

  • ISBN: 9780070371354
  • ISBN10: 0070371350

Electronic Packaging Design, Materials, Process, and Reliability

by John H. Lau

  • List Price: $69.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 03/01/1998
  • ISBN: 9780070371354
  • ISBN10: 0070371350
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Description: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all major packaging and interconnection technologies and details all the newest technologies, including BGA, Flip Chip, and CSP.
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Sewn binding. Cloth over boards. Contains: Illustrations. Electronic
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Sewn binding. Cloth over boards. Contains: Illustrations. Electronic
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