Description: This solid classic presents a practical and realistic approach for developing skills in planning, designing and constructing electronic equipment. Its logical presentation helps beginning technicians become competent in all aspects of electronic packaging design and fabrication techniques. Tracks today's sophisticated design, construction and packaging techniques brought about by the adoption of new electronic device packages for high-density assemblies in conjunction with more functionally complicated printed circuit board technologies. The authors incorporates new material on safety throughout the book, including the latest mailing and Internet addresses of government agencies and private companies involved in safety. Features new material on ergonomics related to using computers. Includes material on multilayer printed circuit board design, layer-to-layer coding, layer representation, antipad and thermal relief pad configurations, and a simple four layer MLB design. Expands coverage of PCB Soldering to include new data acquisition equipment to accurately measure the thermal profile of a soldering iron, as well as new material on cleaning solvents so that informed selections can be made to better protect the atmosphere. Increases coverage of Surface Mount Technology to include new equipment for prototype work as well as small-to-medium volume production.

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