Fundamentals of Microsystems Packaging
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 05/01/2001
Description:
This is an interdisciplinary tutorial designed for electrical, mechanical, chemical, and materials engineers working in the electronic packaging fields. Each chapter covers a major packaging technology according to a master grid, so all chapters follow an identical format. Each chapter includes schematics and block diagrams, problems and solutions, and details the impact of each technology on electrical, materials, chemical, and mechanical tracks.
Expand description
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
Please Wait