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  • ISBN: 9780071371698
  • ISBN10: 0071371699

Fundamentals of Microsystems Packaging

by Steve Chapman

  • List Price: $162.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 05/01/2001
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Description: This is an interdisciplinary tutorial designed for electrical, mechanical, chemical, and materials engineers working in the electronic packaging fields. Each chapter covers a major packaging technology according to a master grid, so all chapters follow an identical format. Each chapter includes schematics and block diagrams, problems and solutions, and details the impact of each technology on electrical, materials, chemical, and mechanical tracks.
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HPB-Dallas
Location: Dallas, TX
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