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Initiatives of Precision Engineering at the Beginning of a Millennium 10th International Conference on Precision Engineering (Icpe), July 18-20, 2001,

by Ichiro Inasaki

  • ISBN: 9780792374145
  • ISBN10: 0792374142

Initiatives of Precision Engineering at the Beginning of a Millennium 10th International Conference on Precision Engineering (Icpe), July 18-20, 2001,

by Ichiro Inasaki

  • List Price: $419.00
  • Binding: Hardcover
  • Publisher: Kluwer Academic Pub
  • Publish date: 07/01/2001
  • ISBN: 9780792374145
  • ISBN10: 0792374142
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Description: Preface. Organizing Committee, International Advisory Committee and Conference Executive Committee. Keynote Paper. Machining of Precision Parts and Microstructures; E. Brinksmeier, et al. Roles of Quantum Nanostructures in Advanced Electronics; H. Sakaki. Design of New Precision Machine Elements; A.H. Slocum. Part I: Cutting / Special machining. The Concept of Active Deflection Compensation and its Application in Precision Forging; E. Doege, et al. Coining of Thin Plates to Produce Micro Channel Structures; G. Hirt, B. Rattay. Three-dimensional Micro-Forming Process of Thin Film Metallic Glass in the Supercooled Liquid Region; S. Hata, et al. Precision Cold Forging - Methods for Reduction of Working Pressure; K.K. Tong, et al. Burr Formation in Micro-Machining Aluminum, 6061-T6; K. Lee, et al. Micro Structuring of High Aspect Ratio and Array by Means of Mechanical Machining; K. Sawada, et al. Influence of Micro Machining on Strength Degradation of a Silicon Nitride Ceramic; M. Wakuda, et al. Micro Material Processing Using UV Laser and Femtosecond Laser; H.K. Tnshoff, et al. Subnanometer Fabrication of Optics by Plasma Chemical Vaporization Machining; H. Takino, et al. Micro Fabrication Using EDM Deposition; S. Hayakawa, et al. Manufacture of Aspherical Fresnel Lens with Ideal Cross-Sectional Profile with Oxygen-free Copper and Acrylic Resin; N. Sornsuwit, et al. Non-circular Machining Using Two Convex Milling Cutters; Y. Nakao. 54 Additional Chapters. Part II: Grinding / polishing / ultra-precision machining. Precision Grinding of Micro Aspherical Surface; H. Suzuki, et al. Mirror Grinding of Silicon Wafer with Silica EPD Pellets; T. Fukazawa, et al. New Fabrication Process ofDeep Paraboloidal Mirror by Combination of ELID-Grinding and Electro-forming Techniques for Laman Spectroscopy Instrument; H. Ohmori, et al. A Study on the Surface Integrity of Single Crystal Silicon Ground by CIFB-diamond Wheels (ELID) and Resin-bonded Diamond Wheels; C.L. Chao, et al. A Study on Scratch Reduction Using the Sonic Dispersion of CMP Slurry; S.H. Choi, et al. A Study on the Chemical Mechanical Micro Machining (C3M) of Silicon; S.C. Jeong, et al. Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer; T. Enomoto, et al. Cryogenic Polishing Method of Optical Materials; F. Zhang, et al. Characteristics of Small Rotary Tool in Polishing of Fused Silica; C. Liu, et al. Development of Electrostrictive Polyurethane(PU) Films and its Characterization; E.-S. Jeong, et al. Precision Machining of Future Silicon Wafers; F. Klocke, D. Phler. High Speed Grinding Performance and Material Removal Mechanism of Silicon Nitride; H. Huang, L. Yin. 19 Additional Chapters. Part III: Machine / element / measurement. Invited paper: Precision Machine Tools; M. Weck, et al. Effects of Bearing Surface Geometries on the Inclination Stiffness of Aerostatic Thrust Bearings; S. Ohishi, et al. Development of a Three Axes Travelling Column Ultraprecision Milling Machine; A. Herrero, R. Bueno. Development of Hydrostatic Bearings with Groove Structures; M. Weck, et al. Asasessment of Thermophysical Properties at Design Stage of Machine Tool Structure with Thermal Symmetricity; M. Okabe, et al. Concrete-Based Constrained Layer Damping; E. Bamberg, A.H. Slocum. Effects of Manufacturing Errors on the Accuracy for TRR-XY Hybrid PKM; T.-H. Chang, et al. Effect of Static Stiffness of Grinding Systems o
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