Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
- List Price: $89.95
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 02/01/2000
Description:
-- A new generation of packaging technologies is transforming the industry and this is the first book to detail their application
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
Expand description
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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