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Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

by John H. Lau

  • ISBN: 9780071351416
  • ISBN10: 0071351418

Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

by John H. Lau

  • List Price: $89.95
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 02/01/2000
  • ISBN: 9780071351416
  • ISBN10: 0071351418
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Description: -- A new generation of packaging technologies is transforming the industry and this is the first book to detail their application
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
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