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Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

by John H. Lau

  • ISBN: 9780071351416
  • ISBN10: 0071351418

Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

by John H. Lau

  • List Price: $89.95
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill
  • Publish date: 02/01/2000
  • ISBN: 9780071351416
  • ISBN10: 0071351418
used Add to Cart $93.20
Marketplace Item
new Add to Cart $929.33
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Description: -- A new generation of packaging technologies is transforming the industry and this is the first book to detail their application
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
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Seller Condition Comments Price  
Seller: Ergodebooks
Location: Richmond, TX Ask seller a question
Condition: Good
Buy with confidence. Excellent Customer Service & Return policy.Ships Fast. 24*7 Customer Service.
Price:
$93.20
Comments:
Buy with confidence. Excellent Customer Service & Return policy.Ships Fast. 24*7 Customer Service.
Seller: FastBooks100
Location: Franklin, TN Ask seller a question
Condition: Good
Price:
$199.95
Comments:
Seller: Ergodebooks
Location: Richmond, TX Ask seller a question
Condition: New
Buy with confidence. Excellent Customer Service & Return policy.Ships Fast. 24*7 Customer Service.
Price:
$929.33
Comments:
Buy with confidence. Excellent Customer Service & Return policy.Ships Fast. 24*7 Customer Service.
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