Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
- List Price: $89.95
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 02/01/2000
Description:
-- A new generation of packaging technologies is transforming the industry and this is the first book to detail their application
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
Expand description
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
| Seller | Condition | Comments | Price |
|
Ergodebooks
|
Good |
$44.03
|
|
Bonita
|
Very Good |
$94.43
|
|
GridFreed
|
New |
$147.91
|
Please Wait