Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
- List Price: $89.95
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 02/01/2000
Description:
-- A new generation of packaging technologies is transforming the industry and this is the first book to detail their application
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
Expand description
-- Gives electrical, mechanical, and materials engineers in electronic packaging a how-to guide on using the flip chip to create the new "packageless packages", such as Direct Chip Attach (DCA)
-- Full of in-depth technical detail from one of the most prominent teachers in the industry
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