Microvias Low Cost, High Density Interconnects
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill
- Publish date: 04/01/2001
Description:
-- The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards -- and driving the mobile electronic revolution
-- A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation
-- Features a detailed survey of the work of leading companies -- and their products from around the globe
Expand description
-- A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation
-- Features a detailed survey of the work of leading companies -- and their products from around the globe
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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