Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill Professional
- Publish date: 01/01/2006
Description:
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
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Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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