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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

by LAU

  • ISBN: 9780070366480
  • ISBN10: 0070366489

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

by LAU

  • List Price: $65.00
  • Binding: Hardcover
  • Edition: 1
  • Publisher: McGraw-Hill Professional
  • Publish date: 01/01/2006
  • ISBN: 9780070366480
  • ISBN10: 0070366489
used Add to Cart $6.35
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Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
new Add to Cart $51.11
You save: 21%
Marketplace Item
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
Description: This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
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Product notice Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
Seller Condition Comments Price  
Seller: GuthrieBooks
Location: Spring Branch, TX
Condition: Very Good
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Size: 6x1x9; Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Price:
$6.35
Comments:
Size: 6x1x9; Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Seller: HPB-Red
Location: Dallas, TX
Condition: Good
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Connecting readers with great books since 1972! Used textbooks may not
[...]
Price:
$6.35
Comments:
Connecting readers with great books since 1972! Used textbooks may not
[...]
Seller: Booksup
Location: Laguna Niguel, CA
Condition: Very Good
Sewn binding. Cloth over boards. 408 p. Electronic Packaging & Interconnection Series. Audience: General/trade.
Price:
$6.75
Comments:
Sewn binding. Cloth over boards. 408 p. Electronic Packaging & Interconnection Series. Audience: General/trade.
Seller: ErgodeBooks
Location: Houston, TX
Condition: Good
Sewn binding. Cloth over boards. 408 p. Electronic Packaging & Interconnection Series.
Price:
$15.58
Comments:
Sewn binding. Cloth over boards. 408 p. Electronic Packaging & Interconnection Series.
Seller: Bonita
Location: Santa Clarita, CA
Condition: Good
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Access codes and supplements are not guaranteed with used items. May be an ex-library book.
Price:
$35.22
Comments:
Access codes and supplements are not guaranteed with used items. May be an ex-library book.
Seller: Just one more Chapter
Location: Miramar, FL
Condition: New
Price:
$51.11
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Seller: GridFreed
Location: North Las Vegas, NV
Condition: New
Size: 9x6x1; New. In shrink wrap. Looks like an interesting title!
Price:
$85.00
Comments:
Size: 9x6x1; New. In shrink wrap. Looks like an interesting title!
Seller: BingoBooks2
Location: Vancouver, WA
Condition: Very Good
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Hardback book in near fine condition.
Price:
$360.00
Comments:
Hardback book in near fine condition.
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