Thermal Management Handbook: for Electronic Assemblies
- Binding: Hardcover
- Edition: 1
- Publisher: McGraw-Hill Education
- Publish date: 04/01/1998
Description:
Electronic systems have shrunk in size far faster than their heat-producing power supplies, leading to major design and reliability problems. This guide provides comprehensive information on the thermal management of printed circuit boards, hybrid circuits, and multichip modules, complete with data tables and a bounty of design examples.
Expand description
Coverage of all thermal management issues in electronic packaging addresses how to measure thermal properties of different materials ... assess heat loss in active devices, in conductor traces, and at high frequencies ... determine temperature at a given point or region in an electronic assembly ... conduct thermal analysis of common configurations found in electronic assemblies ... and cool electronic circuits.
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
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