Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield
- Binding: Hardcover
- Edition: 2
- Publisher: McGraw-Hill
- Publish date: 08/01/1997
Description:
One of the most widely used engineering books in packaging gets a full updating in this classic from the International Microelectronics and Packaging Society (IMAPS).
Expand description
Special emphasis is given to higher density interconnection techniques developed since the first edition. New sections are included on fine pitch SMT and new bonding metallurgies, as well as wire sweep and the wire bonding mechanism. Users gain guidance on how to make reliable bonds at a very high yield ... bond wires to multichip modules ... solve common bonding problems ... make trade-offs between new bonding technologies ... implement the latest techniques of wire bond testing ... and use cleaning techniques that improve bondability and reliability.
Product notice
Returnable at the third party seller's discretion and may come without consumable supplements like access codes, CD's, or workbooks.
| Seller | Condition | Comments | Price |
|
Ergodebooks_N
|
Good |
$507.63
|
Please Wait